HEATSINK TECHNOLOGY

What is A Heatsink?

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What is a heatsink?

A heat sink is used in electronic devices to dissipate heat and prevent overheating. It is typically made of a metal such as aluminum or copper. It absorbs and transfers heat from the device’s central processing unit (CPU) or other heat-generating components. Heat sinks work by increasing the surface area available for heat transfer and using fins or other structures to increase the flow of air or other cooling medium over the surface of the heat sink. This helps to keep the device operating at a safe temperature and prevent damage from overheating.

In many applications, the device is an electronic component (e.g. CPU, GPU, ASIC, FET etc.) and the surrounding fluid is air. The device transfers heat to the heatsink by conduction. The primary mechanism of heat transfer from the heatsink is convection, although radiation also has a minor influence.

There are two distinct types of convection:

Natural convection – where the movement of the fluid particles is caused by the local changes in density due to transfer of heat from the surface of a solid to the fluid particles in close proximity.
Forced convection – where the movement of the fluid particles is caused by an additional device such as a fan or blower.

Heatsinks are designed to significantly increase the contact surface area between solid and fluid, thereby increasing the opportunity for heat transfer. A typical ASIC may have a surface area in contact with air of only 1600mm². The surface area of a typical heatsink used to cool that device may be 10 or 20 times that value.

HOW DOES A HEATSINK WORK?

When electronic components operate, they generate heat due to the flow of electricity through them. This heat must be dissipated to prevent the parts from overheating and failing. A heat sink works by absorbing this heat and spreading it out over a larger surface area, allowing it to dissipate more efficiently.

The heat sink is typically attached to the electronic component using a thermal interface material, such as a thermal paste or pad. This material helps to transfer the heat from the component to the heat sink.

Once the heat is transferred to the heatsink, it dissipates into the surrounding air through convection. The larger the surface area of the heat sink, the more efficient it is at dissipating heat.

Adequate cooling is essential for electronic devices, and heatsinks are an important component of any cooling solution. At China Heat Sink Inc., we are proud to be one of the leading heatsink suppliers in the industry, offering a wide range of high-quality products and exceptional customer service. Contact us today to learn how we can help meet your cooling needs.

HEATSINK CONSTRUCTION

There are many designs for heatsinks, but they typically comprise a base and a number of protrusions attached to this base. The base is the feature that interfaces with the device to be cooled. Heat is conducted through the base into the protrusions. The protrusions can take several forms, including:

Heatsinks are usually constructed from copper or aluminum. Copper has a very high thermal conductivity, which means the rate of heat transfer through copper heatsinks is also very high. Whilst lower than that of copper, aluminum’s thermal conductivity is still high and it has the added benefits of lower cost and lower density, making it useful for applications where weight is a major concern.

HEATSINK PERFORMANCE

The performance of heatsinks are a consequence of many parameters, including:

Geometry
Material
Surface treatment
Air velocity
Interface with device

The last item is very important. Whilst electronic components and heatsink bases are manufactured to be very flat and smooth, at a microscopic level their surfaces are rough. This results in very few points of contact and many tiny air gaps between the component and its heat sink. Air has a low thermal conductivity, resulting in poor conduction of heat from the device to the heatsink. To combat this, a thermal interface material (TIM) can be applied to the base of the heatsink to fill these gaps and provide more conduction paths between device and heatsink.

Heatsink performance is characterized by its thermal resistance. This parameter can be thought of as the difference in temperature between the air around the heatsink and the device surface in contact with the heat sink per unit of input power. Thermal resistance is denoted by the symbol θ and has the unit °C/W.

The junction temperature (T_J) is the temperature of the hottest part of the device. This is the critical temperature for its correct operation. The case temperature (T_C) is the temperature of the surface of the device which is in contact with the heatsink assembly. T_C is lower than T_J due to the junction-to-case thermal resistance (θ_JC). The performance of the heatsink assembly is defined by the case-to-ambient thermal resistance (θ_CA). This is the difference in temperature between the device surface (T_C) and the surrounding air (T_A) for a unit of input power.

The increase in T_J over T_A for each Watt of thermal power the device generates is the sum of θ_JC and θ_CA.

HEATSINK MANUFACTURING METHODS

Heatsinks can be manufactured in a variety of ways depending on the required performance, cost and volume. These include:

Machining – where a CNC machine is used to cut the metal
Extrusion – where metal is heated and pushed through a mold
Forging – where metal is heated and shaped by pressurization
Stamping – where the metal fin is cut, and then soldered onto the base
Skiving – where a blade is used to slice, and push up the single block of metal

For more complex thermal issues, heatpipes and vapor chambers may be employed within the heatsink assembly. These devices are sealed objects containing a fluid (typically water) and utilize the release of heat during fluid phase changes to vastly increase their conductivity when compared to a solid metallic object of the same geometry.

China Heat Sink Inc. offers all these manufacturing techniques and we can therefore provide an unbiased approach to each thermal requirement.

BGA Platefin Heatsinks

Radian’s BGA Aluminum plate fin designs are high efficiency heatsink cooling products which are ideal for linear air-flow environments. These BGA heat sink devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off-the-shelf, high efficiency heatsink solutions are easy to install and require no special board modifications or complex assemblies. The heatsinks are constructed of extruded aluminum for optimum heat transfer. Designed specifically for BGAs and other surface mount packages then finished with black anodize plating.

Radian Part Number	Type	Material	Style	Length (mm)	Width (mm)	Height (mm)	Theta SA (°C/W)at 200LFM	Theta SA (°C/W) at 400LFM	Theta SA (°C/W) at 600LFM
INH27001-15/2.6	BGA	Aluminum	Plate Fin	22.1	26.9	14.6	4.2	2.6	2.1
INH27001-18/2.6	BGA	Aluminum	Plate Fin	22.1	26.9	17.6	3.5	2.2	1.8
INH27001-23/2.6	BGA	Aluminum	Plate Fin	22.1	26.9	22.9	2.7	1.7	1.4
INH33001-15/2.6	BGA	Aluminum	Plate Fin	27.2	32.3	14.6	3.1	1.9	1.5
INH33001-18/2.6	BGA	Aluminum	Plate Fin	27.2	32.3	17.6	2.6	1.6	1.3
INH33001-23/2.6	BGA	Aluminum	Plate Fin	27.2	32.3	22.9	2	1.3	1
INH35001-15/2.6	BGA	Aluminum	Plate Fin	29	34.8	14.6	2.9	1.7	1.3
INH35001-18/2.6	BGA	Aluminum	Plate Fin	29	34.8	17.6	2.4	1.4	1.1
INH35001-23/2.6	BGA	Aluminum	Plate Fin	29	34.8	22.9	1.9	1.2	0.9
INH40001-15/2.6	BGA	Aluminum	Plate Fin	34.5	39.1	14.6	2.5	1.5	1.1
INH40001-18/2.6	BGA	Aluminum	Plate Fin	34.5	39.1	17.6	2.1	1.3	1
INH40001-23/2.6	BGA	Aluminum	Plate Fin	34.5	39.1	22.9	1.7	1	0.8
INL19001-10/1.7	BGA	Aluminum	Plate Fin	19	19	9.5	5.71	4.17	3.57
INL19001-13/1.7	BGA	Aluminum	Plate Fin	19	19	12.7	5.15	3.72	3.16
INL19001-6/1.7	BGA	Aluminum	Plate Fin	19	19	6.3	6.26	4.58	3.97
INL21001-10/1.7	BGA	Aluminum	Plate Fin	21	21	9.5	5.38	3.91	3.32
INL21001-13/1.7	BGA	Aluminum	Plate Fin	21	21	12.7	4.83	3.43	2.91
INL21001-6/1.7	BGA	Aluminum	Plate Fin	21	21	6.3	6.08	4.41	3.79
INL23001-10/1.7	BGA	Aluminum	Plate Fin	23	23	9.5	5.01	3.67	3.06
INL23001-13/1.7	BGA	Aluminum	Plate Fin	23	23	12.7	4.25	3.09	2.61
INL23001-6/1.7	BGA	Aluminum	Plate Fin	23	23	6.3	5.77	4.28	3.63
INL24001-10/1.7	BGA	Aluminum	Plate Fin	24	24	9.5	4.72	3.45	3.83
INL24001-13/1.7	BGA	Aluminum	Plate Fin	24	24	12.7	4.05	2.89	2.39
INL25001-10/1.7	BGA	Aluminum	Plate Fin	25	25	9.5	4.57	3.18	2.63
INL25001-13/1.7	BGA	Aluminum	Plate Fin	25	25	12.7	3..8	2.64	2.15
INL25001-6/1.7	BGA	Aluminum	Plate Fin	25	25	6.3	5.32	3.79	3.15
INL27001-10/1.7	BGA	Aluminum	Plate Fin	27	27	9.5	4.25	3	2.4
INL27001-13/1.7	BGA	Aluminum	Plate Fin	27	27	12.7	3.5	2.4	1.86
INL27001-6/1.7	BGA	Aluminum	Plate Fin	27	27	6.3	4.94	3.58	2.99
INL29001-10/1.7	BGA	Aluminum	Plate Fin	29	29	9.5	3.95	2.66	2.18
INL29001-13/1.7	BGA	Aluminum	Plate Fin	29	29	12.7	3.32	2.2	1.72
INL29001-6/1.7	BGA	Aluminum	Plate Fin	29	29	6.3	4.62	3.23	2.73
INL31001-10/1.7	BGA	Aluminum	Plate Fin	31	31	9.5	3.72	2.55	2.02
INL31001-13/1.7	BGA	Aluminum	Plate Fin	31	31	12.7	3.1	2.02	1.56
INL31001-6/1.7	BGA	Aluminum	Plate Fin	31	31	6.3	4.38	3.13	2.58
INL33001-10/1.7	BGA	Aluminum	Plate Fin	33	33	9.5	3.43	2.25	1.72
INL33001-13/1.7	BGA	Aluminum	Plate Fin	33	33	12.7	2.79	1.73	1.28
INL33001-6/1.7	BGA	Aluminum	Plate Fin	33	33	6.3	4.12	2.83	2.27
INL35001-10/1.7	BGA	Aluminum	Plate Fin	35	35	9.5	3.15	2.01	1.49
INL35001-13/1.7	BGA	Aluminum	Plate Fin	35	35	12.7	2.5	1.56	1.1
INL35001-6/1.7	BGA	Aluminum	Plate Fin	35	35	6.3	3.85	2.48	1.92
INL37.5001-10/1.7	BGA	Aluminum	Plate Fin	37.5	37.5	9.5	2.9	1.75	1.34
INL37.5001-13/1.7	BGA	Aluminum	Plate Fin	37.5	37.5	12.7	2.27	1.31	0.98
INL40001-10/1.7	BGA	Aluminum	Plate Fin	40	40	9.5	2.73	1.68	1.22
INL40001-13/1.7	BGA	Aluminum	Plate Fin	40	40	12.7	2.16	1.25	0.88
INL40001-6/1.7	BGA	Aluminum	Plate Fin	40	40	6.3	3.26	2.08	1.59
INL42.5001-10/1.7	BGA	Aluminum	Plate Fin	42.5	42.5	9.5	2.61	1.61	1.18
INL42.5001-13/1.7	BGA	Aluminum	Plate Fin	42.5	42.5	12.7	2.14	1.2	0.83
INL42.5001-6/1.7	BGA	Aluminum	Plate Fin	42.5	42.5	6.3	3.15	2.01	1.54
INL45001-10/1.7	BGA	Aluminum	Plate Fin	45	45	9.5	2.45	1.47	1.12
INL45001-13/1.7	BGA	Aluminum	Plate Fin	45	45	12.7	1.97	1.11	0.8
INL45001-6/1.7	BGA	Aluminum	Plate Fin	45	45	6.3	2.93	1.87	1.44

Platefin Heatsinks with screws

Radian’s Plate Fin designs are constructed of die cast aluminum and are ideal for omni directional airflow or convection environments. These off-the-shelf, high efficiency heatsink solutions are easy to install with four M3 mounting screws ranging from 4-8mm in length.

Part	Type	Style	Material	Length (mm)	Width (mm)	Height (mm)	Theta SA (°C/W) at 200LFM	Theta SA (°C/W) at 400LFM	Theta SA (°C/W) at 600LFM
HS1568EB	Pushpin	Platefin	Aluminum	57.9	36.8	11.4	2.2	1.3	1
HS1574EB	Pushpin	Platefin	Aluminum	57.9	36.8	22.9	0.9	0.6	0.5
HS1576EB	DCDC	Platefin	Aluminum	61	57.9	11.4	1.4	0.8	0.6
HS1579EB	Pushpin	Platefin	Aluminum	61	57.9	5.8	2.7	1.7	1.3
HS1592EB	DCDC	Platefin	Aluminum	116.8	61	11.4	1.2	0.7	0.5
HS1594EB	DCDC	Platefin	Aluminum	116.8	61	22.9	0.7	0.4	0.3

BGA Aluminum Round Pin Heatsink

Radian’s BGA Aluminum Round Pin is a high efficiency heatsink cooling product which is ideal for omni-directional air flow and convection environments. These devices mount with EZ Snap^TM mounting clips and / or thermal tape for various package sizes and airflow.

Radian Part Number	Type	Material	Style	Length (mm)	Width (mm)	Height (mm)	Theta SA (°C/W) at 200LFM	Theta SA (°C/W) at 400LFM	Theta SA (°C/W) at 600LFM
INM19002-12P/2-6	BGA	Aluminum	Roundpin	19	19	11.6	6.87	4.95	4.26
INM19002-15P/2.6	BGA	Aluminum	Roundpin	19	19	14.6	6.56	4.66	3.96
INM19002-25P/2.6	BGA	Aluminum	Roundpin	19	19	24.6	4.7	3.4	2.7
INM27002-12P/2.6	BGA	Aluminum	Roundpin	27	27	11.6	5.04	3.21	2.38
INM29002-25P/2.6	BGA	Aluminum	Roundpin	29	29	24.6	2.5	1.8	1.4
INM33002-12P/2.6	BGA	Aluminum	Roundpin	33	33	11.6	3.46	2.25	1.66
INM33002-20P/2.6	BGA	Aluminum	Roundpin	33	33	19.6	2.3	1.6	1.3
INM33002-25P/2.6	BGA	Aluminum	Roundpin	33	33	24.6	1.9	1.4	1.2
INM35002-12P/2.6	BGA	Aluminum	Roundpin	35	35	11.6	3.18	2.04	1.53
INM35002-15P/2.6	BGA	Aluminum	Roundpin	35	35	14.6	2.97	1.87	1.37
INM35002-20P/2.6	BGA	Aluminum	Roundpin	35	35	19.6	2	1.5	1.2
INM35002-25P/2.6	BGA	Aluminum	Roundpin	35	35	24.6	1.8	1.3	1
INM37.5002-15P/2.6	BGA	Aluminum	Roundpin	37.5	37.5	14.6	2.83	1.78	1.23
INM40002-12P/2.6	BGA	Aluminum	Roundpin	40	40	11.6	2.96	1.92	1.39
INM40002-20P/2.6	BGA	Aluminum	Roundpin	40	40	19.6	1.7	1.2	0.9
INM42.5002-20P/2.6	BGA	Aluminum	Roundpin	42.5	42.5	19.6	2.19	1.18	0.73
INM42.5002-25P/2.6	BGA	Aluminum	Roundpin	42.5	42.5	24.6	1.3	0.8	0.7

BGA Copper Round Pin Heatsink

Radian’s copper round pin design is a high efficiency heatsink cooling products which is ideal for omni-directional airflow and convection environments. These BGA Heatsink devices mount with EZ Snap™ mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. These off-the-shelf, high efficiency heatsink solutions are easy to install and require no special board modifications or complex assemblies. The heatsinks are constructed of forged CU1100 oxygen-free copper for optimum heat transfer.

inm29002	Type	Material	Style	Length (mm)	Width (mm)	Height (mm)	Theta SA (°C/W) at 200LFM	Theta SA (°C/W) at 400LFM	Theta SA (°C/W) at 600LFM
INM19002-12PCU/2.6	BGA	Copper	Roundpin	19	19	11.6	6.08	4.39	2.95
INM19002-15PCU/2.6	BGA	Copper	Roundpin	19	19	14.6	5.79	4.12	3.47
INM19002-20PCU/2.6	BGA	Copper	Roundpin	19	19	19.6	4.2	3.1	2.6
INM19002-25PCU/2.6	BGA	Copper	Roundpin	19	19	24.6	3.9	2.9	2.4
INM27002-12PCU/2.6	BGA	Copper	Roundpin	27	27	11.6	4.34	3.05	2.36
INM27002-15PCU/2.6	BGA	Copper	Roundpin	27	27	14.6	4.07	2.83	2.15
INM27002-20PCU/2.6	BGA	Copper	Roundpin	27	27	19.6	2.8	2.1	1.7
INM27002-25PCU/2.6	BGA	Copper	Roundpin	27	27	24.6	2.6	1.9	1.6
INM29002-12PCU/2.6	BGA	Copper	Roundpin	29	29	11.6	3.93	2.59	2
INM33002-25PCU/2.6	BGA	Copper	Roundpin	33	33	24.6	1.6	1	0.8
INM35002-12PCU/2.6	BGA	Copper	Roundpin	35	35	11.6	3.13	2.02	1.5
INM35002-15PCU/2.6	BGA	Copper	Roundpin	35	35	14.6	2.83	1.79	1.33
INM40002-12PCU/2.6	BGA	Copper	Roundpin	40	40	11.6	2.81	1.77	1.29
INM40002-15PCU/2.6	BGA	Copper	Roundpin	40	40	14.6	2.59	1.59	1.09
INM40002-20PCU/2.6	BGA	Copper	Roundpin	40	40	19.6	1.5	1	0.8
INM40002-25PCU/2.6	BGA	Copper	Roundpin	40	40	24.6	1.4	0.9	0.7
INM42.5002-12PCU/2.6	BGA	Copper	Roundpin	42.5	42.5	11.6	2.67	1.66	1.19
INM42.5002-25PCU/2.6	BGA	Copper	Roundpin	42.5	42.5	24.6	1.2	0.8	0.7

Roundpin heatsink with screws

Radian’s Round pin designs are constructed of die cast aluminum and are ideal for omni directional airflow or convection environments. These off-the-shelf, high efficiency heatsink solutions are easy to install with four M3 mounting screws ranging from 4-8mm in length.

Round Pin Heatsink with Pushpins

The INM37.5 Series of aluminum and copper round pin designs are high efficiency heatsink cooling products which are ideal for omni-directional air flow.

Small Round Pin Heatsink

The Miniature Series of aluminum heatsinks are high efficiency cooling products which are ideal for omni-directional airflow. These devices may be packaged with optional thermal tape to facilitate installation of the heatsinks.

BGA Elliptical fin Heatsinks

Radian has a wide range of Elliptical Fin designs that are available to ship within a few days. If a part or BGA heatsink size is not available online we can usually offer an alternative part, or modify a part in stock to fit your needs. For lower volumes, we can also precision machine a cross-cut heatsink to fit our EZ-snap clip, that can offer similar performance, and for larger volumes a precision casting can be made for your exact requirements. Please contact us if you need help selecting the correct solution.

Radian Part Number	Type	Material	Style	Length (mm)	Width (mm)	Height (mm)	Theta SA (°C/W) at 200LFM	Theta SA (°C/W) at 400LFM	Theta SA (°C/W) at 600LFM
INM17001-11W/1.7	BGA	Aluminum	Elliptical	17	17	10.7	7.8	6.1	5.43
INM17001-14W/1.7	BGA	Aluminum	Elliptical	17	17	13.7	7.16	5.54	4.82
INM17001-22W/1.7	BGA	Aluminum	Elliptical	17	17	21.7	5.74	4.36	3.69
INM17001-32W/1.7	BGA	Aluminum	Elliptical	17	17	31.7	4.83	3.66	3.18
INM19001-15W/2.6	BGA	Aluminum	Elliptical	19	19	14.6	5.89	4.48	3.84
INM19001-18W/2.6	BGA	Aluminum	Elliptical	19	19	17.6	5.45	4.03	3.48
INM19001-23W/2.6	BGA	Aluminum	Elliptical	19	19	22.6	4.7	3.46	2.98
INM19001-33W/2.6	BGA	Aluminum	Elliptical	19	19	32.6	3.88	2.88	2.54
INM21001-15W/2.6	BGA	Aluminum	Elliptical	21	21	14.6	5.1	3.46	2.82
INM21001-28W/2.6	BGA	Aluminum	Elliptical	21	21	27.6	3.74	2.52	2.04
INM21001-33W/2.6	BGA	Aluminum	Elliptical	21	21	32.6	3.43	2.29	1.9
INM23001-15W/2.6	BGA	Aluminum	Elliptical	23	23	14.6	4.22	2.94	2.46
INM23001-21W/2.6	BGA	Aluminum	Elliptical	23	23	20.6	3.69	2.49	2.06
INM23001-28W/2.6	BGA	Aluminum	Elliptical	23	23	27.6	3.1	2.1	1.6
INM23001-33W/2.6	BGA	Aluminum	Elliptical	23	23	32.6	2.82	1.89	1.6
INM25001-18W/2.6	BGA	Aluminum	Elliptical	25	25	17.6	3.7	2.52	2.05
INM25001-23W/2.6	BGA	Aluminum	Elliptical	25	25	22.6	3.18	2.18	1.76
INM27001-15W/2.6	BGA	Aluminum	Elliptical	27	27	14.6	3.89	2.66	2.23
INM27001-18W/2.6	BGA	Aluminum	Elliptical	27	27	17.6	3.59	2.42	2.01
INM27001-23W/2.6	BGA	Aluminum	Elliptical	27	27	22.6	3.08	2.04	1.66
INM27001-28W/2.6	BGA	Aluminum	Elliptical	27	27	27.6	2.78	1.78	1.47
INM27001-33W/2.6	BGA	Aluminum	Elliptical	27	27	32.6	2.52	1.61	1.31
INM29001-15W/2.6	BGA	Aluminum	Elliptical	29	29	14.6	3.81	2.52	2.02
INM29001-18W/2.6	BGA	Aluminum	Elliptical	29	29	17.6	3.56	2.31	1.84
INM29001-33W/2.6	BGA	Aluminum	Elliptical	29	29	32.6	2.47	1.49	1.18
INM31001-15W/2.6	BGA	Aluminum	Elliptical	31	31	14.6	3.13	2.02	1.66
INM31001-18W/2.6	BGA	Aluminum	Elliptical	31	31	17.6	2.85	1.79	1.45
INM31001-21W/2.6	BGA	Aluminum	Elliptical	31	31	20.6	2.63	1.63	1.31
INM31001-23W/2.6	BGA	Aluminum	Elliptical	31	31	22.6	2.44	1.5	1.19
INM31001-28W/2.6	BGA	Aluminum	Elliptical	31	31	27.6	2.21	1.36	1.05
INM31001-33W/2.6	BGA	Aluminum	Elliptical	31	31	32.6	2.02	1.19	0.93
INM33001-15W/2.6	BGA	Aluminum	Elliptical	33	33	14.6	2.97	1.88	1.54
INM33001-18W/2.6	BGA	Aluminum	Elliptical	33	33	17.6	2.69	1.7	1.37
INM33001-21W/2.6	BGA	Aluminum	Elliptical	33	33	20.6	2.5	1.52	1.22
INM33001-23W/2.6	BGA	Aluminum	Elliptical	33	33	22.6	2.3	1.37	1.08
INM33001-28W/2.6	BGA	Aluminum	Elliptical	33	33	27.6	2.08	1.23	0.98
INM35001-21W/2.6	BGA	Aluminum	Elliptical	35	35	20.6	2.35	1.52	1.15
INM35001-23W/2.6	BGA	Aluminum	Elliptical	35	35	22.6	2.13	1.35	1.01
INM35001-28W/2.6	BGA	Aluminum	Elliptical	35	35	27.6	1.94	1.19	0.86
INM35001-33W/2.6	BGA	Aluminum	Elliptical	35	35	32.6	1.69	1.02	0.72
INM40001-21W/2.6	BGA	Aluminum	Elliptical	40	40	20.6	2.13	1.31	0.97
INM40001-23W/2.6	BGA	Aluminum	Elliptical	40	40	22.6	1.93	1.15	0.85
INM40001-28W/2.6	BGA	Aluminum	Elliptical	40	40	27.6	1.73	1	0.73
INM40001-33W/2.6	BGA	Aluminum	Elliptical	40	40	32.6	1.55	0.85	0.62
INM42.5001-15W/2.6	BGA	Aluminum	Elliptical	42.5	42.5	14.6	2.48	1.63	1.27
INM42.5001-18W/2.6	BGA	Aluminum	Elliptical	42.5	42.5	17.6	2.25	1.42	1.1
INM42.5001-21W/2.6	BGA	Aluminum	Elliptical	42.5	42.5	20.6	2.04	1.27	0.93
INM42.5001-23W/2.6	BGA	Aluminum	Elliptical	42.5	42.5	22.6	1.86	1.1	0.79
INM42.5001-28W/2.6	BGA	Aluminum	Elliptical	42.5	42.5	27.6	1.66	0.92	0.62
INM45001-15W/2.6	BGA	Aluminum	Elliptical	45	45	14.6	2.42	1.57	1.15
INM45001-18W/2.6	BGA	Aluminum	Elliptical	45	45	17.6	2	1.39	0.99
INM45001-21W/2.6	BGA	Aluminum	Elliptical	45	45	20.6	2	1.22	0.85
INM45001-23W/2.6	BGA	Aluminum	Elliptical	45	45	22.6	1.79	1.08	0.74
INM45001-28W/2.6	BGA	Aluminum	Elliptical	45	45	27.6	1.59	0.91	0.6
INM45001-33W/2.6	BGA	Aluminum	Elliptical	45	45	32.6	0.9	0.7	0.5

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