HEATSINK TECHNOLOGY

FANSINK

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Fansinks, or heatsinks with fans, are a style of impingement cooling that often shows to be 15% to 20% better in comparison to traditional cross-flow forced convection cooling. The design consists of an integrated fan mounted to the top of the heatsink, forcing air between fins and breaking the boundary layer of the heatsink base, effectively dissipating heat generated by electronic components. They consist of a metal heat-conductive base, usually made of aluminum or copper, with numerous fins that increase the surface area for better heat dissipation. Attached to the fins is a fan that helps to generate airflow, expelling the heat away from the components.

The primary function of fansinks is to improve localized airflow. As electronic devices become more powerful and compact, they generate more heat in a smaller space. Without proper cooling, this heat buildup can cause your equipment to throttle or even shut down to prevent damage.

China Heat Sink Inc. offers a wide array of fansinks to keep electronic devices running at optimal temperatures. Our fansinks are available in various sizes and configurations to suit different devices and applications. Whether you need fansinks for computer processors, graphics cards, or other electronic components, we have many options to meet your cooling needs.

Fansink Thermal

WHAT IS A FANSINK?

A Fansink is classed as an Active heatsink as it uses a fan that is attached to a standard Heatsink  to create its own cooling. This active heatsink is a great option when working in a test environment, or for demo boards as they provide around 200 LFM of airflow. Fansinks have many names  such as Fan Heatsinks or HSF, which is short for heat sink and fan. A FanSink provides significant cooling benefits over system level fans for a single component as the dedicated fan increases localized airflow while improving thermal efficiency, and thermal performance over a passive heatsink solution. By matching the fan performance with the correct style heatsink base, and thermal analysis, fan heatsinks can be designed to meet specific application requirements. This type of Active heatsink requires a power source typically from the board at either 5 or 12 volts.

Active Heatsink options

As a fan-sink manufacturer, we primarily focus on producing high-quality cooling solutions for electronic devices. Our fan sinks are designed to efficiently dissipate heat from the components of electronic devices, thereby preventing overheating and damage. We use advanced technology and materials in manufacturing to ensure that our fan sinks are practical but also durable and long-lasting. Our fan sinks suit various devices, including computers, gaming consoles, and servers. We are committed to providing our customers with the best possible cooling solutions to ensure their devices operate at optimal performance levels.

Radian has a wide range of active heatsink solutions. Most are using the fan heatsink style where either a BGA heatsink or platefin with pushpins has a fan attached. For more exotic thermal solutions we have coupled a thermoelectric cooler (TEC) to a heatsink. For more information please contact us.
The following lists are standard parts that we usually have available to ship within a few days.

BGA Fansink

BGA Fansink

Radian’s aluminum  BGA Fansink is a high efficiency heatsink cooling product designed for BGA chipsets and other OEM applications. The Fansink mounts with a EZ Snap™ clip to provide optimum cooling for various package sizes, and are easy to install and require no special board modifications or complex assemblies. The heatsinks are constructed of aluminum for optimum heat transfer and are designed specifically for BGAs and other surface mount packages then finished with black anodize plating. Our standard Fansink is mounted with screws the top, but for environments with high frequency vibration custom solutions are available that include attaching to the base of the heatsink using countersunk screws and lock-nuts.

EZ Snap Clips

Ez Snap Mounting Clips are design specifically for processors and ball grid array (BGA) components. The clips attach the BGA Fansink directly to the BGA component making use of the gap created by the ball grid array (BGA) between the component underside and PCB top surface. Therefore, the EZ Snap™ clips require no holes or modifications to the PCB. They also allow for easy rework of components with fast and easy installation and removal.

EZ Snap Clip Drawing

When selecting the correct clip, it is important to get a clip that is within the range of the nominal chip height. This is the chip height without the solder balls. If the nominal is not available on the chip datasheet just use (max + min)/2. Where a particular chip height is not available, the base of the BGA heatsink can be reduced to provide correct fitment. If there are any issues please contact our team to verify fitment size.

BGA Fansink

Radian Part NumberTypeVoltage (V)StyleLength (mm)Width (mm)Height (mm)Theta SA (°C/W)Store
FA35BGA12VFansink353524.61.7
FA40BGA12VFansink404024.31.3
FA45BGA12VFansink454523.31.2
FA47.5BGA12VFansink47.547.529.651.2
FB35BGA5VFansink353525.11.9
FB40BGA5VFansink404023.31.3
FB42.5BGA5VFansink42.542.525.31.3
FB45BGA5VFansink454524.31.2
FI27BGA12VFansink2727212.1
FI42.5BGA12VFansink42.542.525.21.3
FJ27BGA5VFansink2727212.1
FJ35BGA5VFansink353521.91.8
FJ42.5BGA5VFansink42.542.525.21.3
Fansink with pushpins

Fansink with Pushpins

China Heat Sink Inc. also offer a large variety of custom Fan sinks in addition to our standard line. These Custom Fansinks can be mounted using Screws or Pushpins. We also take care when selecting a fan to meet a customers performance, and budget requirements when considering the type of bearings.

Features:

  • High efficiency aluminum  fin design provides low pressure-drop characteristics
  • Constructed of extruded aluminum AL6063 for optimum heat transfer
  • DC Fan for improved heat dissipation
  • Finished with black anodize plating
  • Pushpin & thermal pad options are pre-assembled at the factory
Radian Part NumberTypeVoltage (V)StyleLength (mm)Width (mm)Height (mm)Theta SA (°C/W)Store
FE1567Pushpin12VFansink36.857.913.82.3
FE1568Pushpin12VFansink36.857.920.21.5
FE1569Pushpin12VFansink36.857.925.81.3
FE1570Pushpin12VFansink36.857.929.361.1
FE1575Pushpin12VFansink57.960.916.81.9
FE1576Pushpin12VFansink57.960.921.91.8
FE1577Pushpin12VFansink57.960.928.31
FE1578Pushpin12VFansink57.960.934.80.9
FF1567Pushpin5VFansink36.857.9192.3
FF1568Pushpin5VFansink36.857.924.61.5
FF1569Pushpin5VFansink36.857.925.81.3
FF1570Pushpin5VFansink36.857.929.71.1
FF1575Pushpin5VFansink57.960.916.51.9
FF1576Pushpin5VFansink57.960.922.11.8
FF1577Pushpin5VFansink57.960.928.41
FF1578Pushpin5VFansink57.960.933.50.9
Scorpion-Fans-with-label-scaled

PCIe Fansink

If airflow is an issue, a PCIe fansink has is an active heatsink that has been specifically designed for PCI card applications, but is also ideal for other low profile applications. The fansink has been modeled for pushpins, but can also be used with screws. For exact details on a particular PCIe fansink, please contact us for more information.

Radian Part NumberTypeVoltage (V)StyleHeatsink MaterialLength (mm)Width (mm)Height (mm)Theta SA (°C/W)Store
SZ05SPushpin5VFansinkAluminum505010.52.2
SZ05LPushpin5VFansinkAluminum63.375010.51.85
SZ12SPushpin12VFansinkAluminum505010.52.2
SZ12LPushpin12VFansinkAluminum63.375010.51.85
SC05SPushpin5VFansinkCopper505010.51.5
SC05LPushpin5VFansinkCopper63.375010.51.4
SC12SPushpin12VFansinkCopper505010.51.5
SC12LPushpin12VFansinkCopper63.375010.51.4

5V or 12V Fans

Standard BGA sizes

Custom Fansinks

FANSINKS FOR BETTER COOLING